Description
Features
Intel Socket LGA 1700: Supports 13th and 12th Gen Series Processors
Unparalleled Performance: Hybrid 6+2+1 Phases Digital VRM Solution
Dual Channel DDR5:4 x DIMMs XMP Memory Module Support
Next Generation Storage: 2 x PCIe 4.0 x4 M.2 Connectors
M.2 Thermal Guard: To Ensure M.2 SSD Performance
EZ-Latch: PCIe 4.0×16 Slot with Quick Release Design
Fast Networks: 2.5GbE LAN
Extended Connectivity: Rear USB-C 10Gb/s, DP, HDMI
Smart Fan 6: Features Multiple Temperature Sensors, Hybrid Fan Headers with FAN STOP
Q-Flash Plus: Update BIOS Without Installing the CPU, Memory and Graphics Card
Are you on the hunt for a reliable and feature-rich micro ATX motherboard to build your dream PC? Look no further than the B760M DS3H (rev. 1.0), an exceptional motherboard designed to cater to all your computing needs. With cutting-edge features, robust performance, and a compact form factor, this motherboard sets new standards for efficiency and versatility.
6+2+1 Phases Hybrid Digital VRM Design:
• 6+2+1 Phases Low RDS(on) MOSFETs
• Premium Choke and Capacitors to improve transient response and minimize oscillation
PCIe 4.0 Design:
GIGABYTE B760 Motherboards are ready to work with the PCIe 4.0 devices which are expected to experience triple bandwidth than the current PCIe 3.0 devices. To reach the high speed and maintain good signal integrity, GIGABYTE R&D uses the low impedance PCB to provide the maximum performance.
Unlock DDR5:
GIGABYTE is offering a tested and proven platform that has memory overclocking capability up to 7600 and beyond. For DDR5 XMP Memory, all users need to do to attain high memory performance boost is to ensure that their memory module is XMP capable and that the XMP function is activated and enabled on their GIGABYTE motherboard
PerfDrive:
PerfDrive technology integrates multiple GIGABYTE exclusive BIOS settings to allow users to balance between different levels of performance, power consumption, and temperature according to their needs easily when using 13th gen Intel® Core™ processors.
Enlarged Surface MOSFET Heatsink:
Enlarged Surface Design of MOSFET Heatsink greatly improves heat dissipation.
GIGABYTE Ultra-Efficient M.2 Thermal Guard:
With durability in mind, GIGABYTE provides a thermal solution for M.2 SSD devices. The M.2 Thermal Guard prevents throttling and bottlenecks from high speed M.2 SSDs as it helps to dissipate heat before it becomes an issue.
High-Quality Audio and LAN Connectivity:
Experience crystal-clear audio and lag-free networking with the B760M DS3H (rev. 1.0)’s high-quality audio capacitors and Gigabit LAN port. Enjoy immersive gaming audio and smooth online experiences without compromise.
SMART FAN 6:
Smart Fan 6 contains several unique cooling features that ensure gaming PC maintain its performance while staying cool and quiet. Multiple fan headers can support PWM/DC fan and pump, and users can easily define each fan curve based on different temperature sensors across the board via intuitive user interface.
First adopter on 2.5GbE LAN onboard:
Adoption of 2.5G LAN provide up to 2.5 GbE network connectivity, with at least 2 times faster transfer speeds compared to general 1GbE networking, perfectly designed for gamers with ultimate online gaming experience.
Support Multi-Gig(10/100/1000/2500Mbps) RJ-45 Ethernet
Connecting the Future – USB 3.2 Gen 2 Type-C:
The USB Type-C® is a new reversible connector that is loaded with useful features such as USB 3.2 Gen 2 support for 10Gb/s transfer speed. Powered by the Intel® USB 3.2 Gen 2 controller, this little port provides the best USB Type-C® experience possible.
Specifications
CPU
LGA1700 socket: Support for the 13th and 12th Generation Intel® Core™, Pentium® Gold and Celeron® Processors
L3 cache varies with CPU
Chipset
Intel® B760 Express Chipset
Memory
Support for DDR5 7600(O.C.) /7400(O.C.) /7200(O.C.) /7000(O.C.) /6800(O.C.) /6600(O.C.) / 6400(O.C.) / 6200(O.C.) / 6000(O.C.) / 5800(O.C.) / 5600(O.C.) / 5400(O.C.) / 5200(O.C.) / 4800 / 4000 MT/s memory modules
4 x DDR5 DIMM sockets supporting up to 192 GB (48 GB single DIMM capacity) of system memory
Dual channel memory architecture
Support for ECC Un-buffered DIMM 1Rx8/2Rx8 memory modules (operate in non-ECC mode)
Support for non-ECC Un-buffered DIMM 1Rx8/2Rx8/1Rx16 memory modules
Support for Extreme Memory Profile (XMP) memory modules
(The CPU and memory configuration may affect the supported memory types, data rate (speed), and number of DRAM modules, please refer to “Memory Support List” for more information.)
Onboard Graphics
Integrated Graphics Processor-Intel® HD Graphics support:
1 x D-Sub port, supporting a maximum resolution of 1920×1200@60 Hz km
1 x HDMI port, supporting a maximum resolution of 4096×2160@60 Hz
* Support for HDMI 2.0 version and HDCP 2.3.
1 x DisplayPort, supporting a maximum resolution of 4096×2304@60 Hz
* Support for DisplayPort 1.2 version and HDCP 2.3
1 x DisplayPort, supporting a maximum resolution of 4096×2304@60 Hz
* Support for DisplayPort 1.2 version.
(Graphics specifications may vary depending on CPU support.)
Support for up to quad-display at the same time
Audio
Realtek® Audio CODEC
High Definition Audio
2/4/5.1/7.1-channel
* You can change the functionality of an audio jack using the audio software. To configure 7.1-channel audio, access the audio software for audio settings.
Support for S/PDIF Out
LAN
Realtek® 2.5GbE LAN chip (2.5 Gbps/1 Gbps/100 Mbps)
Expansion Slots
CPU:
1 x PCI Express x16 slot, supporting PCIe 4.0 and running at x16
Chipset:
2 x PCI Express x1 slots, supporting PCIe 3.0 and running at x1
Storage Interface
CPU:
1 x M.2 connector (Socket 3, M key, type 2280 PCIe 4.0 x4/x2 SSD support) (M2A_CPU)
Chipset:
1 x M.2 connector (Socket 3, M key, type 2280 PCIe 4.0 x4/x2 SSD support) (M2P_SB)
4 x SATA 6Gb/s connectors
RAID 0, RAID 1, RAID 5, and RAID 10 support for SATA storage devices
USB
Chipset:
1 x USB Type-C® port on the back panel, with USB 3.2 Gen 2 support
5 x USB 3.2 Gen 1 ports (3 ports on the back panel, 2 ports available through the internal USB header)
2 x USB 2.0/1.1 ports on the back panel
Chipset+2 USB 2.0 Hubs:
4 x USB 2.0/1.1 ports available through the internal USB headers
Internal I/O Connectors
1 x 24-pin ATX main power connector
1 x 8-pin ATX 12V power connector
1 x CPU fan header
3 x system fan headers
1 x addressable LED strip header
1 x RGB LED strip header
2 x M.2 Socket 3 connectors
4 x SATA 6Gb/s connectors
1 x front panel header
1 x front panel audio header
1 x USB 3.2 Gen 1 header
2 x USB 2.0/1.1 headers
1 x Trusted Platform Module header (For the GC-TPM2.0 SPI/GC-TPM2.0 SPI 2.0 module only)
1 x serial port header
1 x parallel port header
1 x S/PDIF Out header
1 x Q-Flash Plus button
1 x reset jumper
1 x Clear CMOS jumper
Back Panel Connectors
2 x USB 2.0/1.1 ports
1 x PS/2 keyboard/mouse port
1 x D-Sub port
1 x HDMI port
2 x DisplayPorts
3 x USB 3.2 Gen 1 ports
1 x USB Type-C® port, with USB 3.2 Gen 2 support
1 x RJ-45 port
3 x audio jacks
I/O Controller
iTE® I/O Controller Chip
H/W Monitoring
Voltage detection
Temperature detection
Fan speed detection
Water cooling flow rate detection
Fan fail warning
Fan speed control
* Whether the fan speed control function is supported will depend on the cooler you install.
BIOS
1 x 128 Mbit flash
Use of licensed AMI UEFI BIOS
PnP 1.0a, DMI 2.7, WfM 2.0, SM BIOS 2.7, ACPI 5.0
Unique Features
Support for GIGABYTE Control Center (GCC)
* Available applications in GCC may vary by motherboard model. Supported functions of each application may also vary depending on motherboard specifications.
Support for Q-Flash
Support for Q-Flash Plus
Bundled Software
Norton® Internet Security (OEM version)
LAN bandwidth management software
Operating System
Support for Windows 11 64-bit
Support for Windows 10 64-bit
Form Factor
Micro ATX Form Factor; 24.4cm x 24.4cm
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